Job Details

Job Details:

Job Description:

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

About This Opportunity:

Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities. WCS focuses on developing advanced wireless technologies and solutions that enable seamless connectivity across a wide range of devices and platforms. The group specializes in wireless communication products including Wi-Fi, Bluetooth, and emerging wireless standards, delivering high-performance, reliable, and secure wireless solutions.

WCS drives innovation in wireless connectivity by integrating cutting-edge hardware and software technologies to meet the evolving needs of consumers and enterprise customers. The business unit ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with Intel's global standards and country-specific requirements.

WCS is committed to advancing wireless communication capabilities, supporting Intel's leadership in the wireless ecosystem, and enabling next-generation connected experiences.

As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.

What You'll Do -

Strategic Leadership and Architecture:

• Translate product requirements into comprehensive package architecture specifications

• Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards

• Define overall product package performance specifications and drive technology certification

• Oversee end-to-end package development processes, from design through production

Technical Excellence and Innovation:

• Troubleshoot complex packaging problems and develop innovative, cost-effective solutions

• Research packaging assembly materials and properties, establishing specifications for suppliers

• Perform mechanical and reliability simulations to optimize package design

• Conduct thermal performance simulations using predictive FEA analysis

Cross-Functional Collaboration:

• Partner with silicon, hardware, and package design teams to ensure high-quality deliverables

• Coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers

• Support product co-design and layout teams as manufacturing liaison

• Collaborate with Quality & Reliability teams to ensure products meet specifications

• Complete DFMEA assessments with assembly suppliers to evaluate technology risks

Manufacturing and Process Management:

• Ensure seamless transition from design to high-volume production

• Design and validate Test Vehicles for process characterization

• Provide consultation on packaging improvements and process optimization

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

This position is not eligible for Intel immigration sponsorship.

Education and Experience

Minimum Requirements:

Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience OR Master's degree in relevant field + 3+ years experience OR PhD in relevant field + 1+ years experience

Required Technical Skills:

• 2+ years package assembly technology development experience

• 2+ years packaging physics (mechanical and thermal) and/or materials experience

• 2+ years package assembly manufacturing processes and HVM ramp experience

Preferred Qualifications:

• Semiconductor device physics and process engineering experience

• RF Component Packaging experience (highly valued for wireless products)

• Testing systems experience with hardware/software (Matlab, LabView

Essential Skills:

• Strong project management capabilities

• Proficiency in Microsoft Office Suite

• Excellent communication and presentation abilities

• Self-driven with strong problem-solving tenacity

• Action-oriented mindset

Why This Role Matters:

You'll be at the forefront of wireless technology innovation, directly impacting next-generation WiFi, Bluetooth, and mmWave solutions that connect the world.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, California, Santa Clara

Additional Locations:

US, Arizona, Phoenix, US, California, Folsom, US, Oregon, Hillsboro

Business group:

The Silicon Engineering Group (SIG) is a worldwide organization focused on the development and integration of SOCs, Cores, and critical IPs from architecture to manufacturing readiness that power Intel's leadership products. This business group leverages an incomparable mix of experts with different backgrounds, cultures, perspectives, and experiences to unleash the most innovative, amazing, and exciting computing experiences.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel ( .

Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.